中文 
English
This kind of radiator is first made of aluminum or copper plate fins, and then combined with the heat transfer paste or solder on the heat sink base with grooves. The characteristics of the combined type radiator are that the fins break through the original proportion limit, and the heat dissipation effect is good, and different materials can be selected to make the fins. The advantages of this process are that the pin fin ratio of the radiator can be as high as 60, the heat dissipation effect is good, and the fins can be made of different materials.
The disadvantage is that there will be interface impedance problem between the fin and the base, which will affect the heat dissipation. In order to improve these shortcomings, two new technologies are used in the field of radiator.
The first is gear shaping technology, which combines the aluminum sheet in the base of the copper sheet under the pressure of more than 60 tons, and no medium is used between the two. From the microscopic point of view, the atoms of the two are connected to each other to a certain extent, so as to completely avoid the disadvantages of the traditional combination of the two to produce interface thermal resistance, and greatly improve the heat transfer ability of the product.
The second is the reflow soldering technology. The big problem of the traditional joint type heat sink is the interface impedance problem, and the reflow soldering technology is the improvement of this problem. In fact, the process of reflow soldering is almost the same as that of traditional joint type heat sink, only a special reflow soldering furnace is used, which can accurately set the welding temperature and time parameters. The solder is made of lead tin alloy, so that the welding and the welded metal can be fully contacted, so as to avoid missed soldering and empty soldering, and ensure that the connection between the fin and the base is as close as possible, and the maximum limit is reached It can also control the melting time and temperature of each solder joint to ensure the uniformity of all solder joints. However, the price of this special reflow oven is very expensive. Motherboard manufacturers use it more, while radiator manufacturers rarely use it. Generally speaking, the radiator adopting this process is mostly used for high-end, and the price is more expensive.