中文 
English
After considering the respective disadvantages of copper and aluminum, some high-end radiators in the current market often use copper aluminum combined manufacturing process. These radiators usually use copper metal base, while the fins are made of aluminum alloy. Of course, in addition to the copper bottom, there are also heat sinks, using copper columns and other methods, which are the same principle. With high thermal conductivity, copper bottom can quickly absorb the heat released by CPU; aluminum fin can be made into a shape conducive to heat dissipation with the help of complex process means, and provide large heat storage space and fast release, which has found a balance point in all aspects.
Heat from the CPU core to the surface of the heat sink is a heat conduction process. For the base of the heat sink, because it is directly in contact with a small area of high heat source, it requires the base to be able to conduct heat quickly. It is very helpful to select the material with high heat conductivity for the heat sink to improve the heat transfer efficiency. It can be seen from the comparison table of heat conduction system that the heat conduction coefficient of aluminum is 237w / MK, and that of copper is 401w / MK. compared with the radiator of the same volume, the weight of copper is three times that of aluminum, while the specific heat of aluminum is only 2.3 times that of copper. Therefore, the copper radiator can hold more heat than the aluminum radiator, and the temperature rise is slower. With the same thickness of radiator base, copper can not only quickly lead away the temperature of heat source such as CPU die, but also its own temperature rise is slower than that of aluminum radiator. Therefore, copper is more suitable for the bottom of radiator.